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SMT ASSEMBLY

SMT Assembly

Fully automatic high-speed placement lines supporting 0201 micro-components and precision BGA assembly. Strict control from solder paste printing to reflow soldering.

SMT Assembly Showcase

ATTENTION TO DETAIL

Attention to Detail is Our Habit

From material inspection to outgoing quality checks, every process has strict standards and records to ensure stable and reliable product quality.

Material Inspection

Material quality determines the lifespan of the PCBA. All incoming materials undergo strict inspection before warehousing.

Solder Paste Inspection

Using imported SPI equipment to check height, area, volume, and offset, preventing insufficient or excessive solder paste.

IPQC Material Verification

Referring to engineering drawings and BOM, IPQC measures and verifies every component on the first article board.

SMT First Article Test

According to BOM and Gerber files, each component on the first board is measured to ensure it matches customer requirements.

DIP Process Inspection

Before DIP, special requirements for component orientation and pins are explained, and QC staff patrol to ensure insertion quality.

QA Outgoing Inspection

According to process and workstation instructions, all production processes are spot-checked to ensure packaging and shipping only after passing.

MANUFACTURING PROCESS

SMT Production Process

01

Quote

02

Place Order

03

Eng. Review

04

Sourcing

05

IQC Check

06

Baking

07

Printing

08

SPI Check

09

Placement

10

Inline AOI

11

Reflow

12

Offline AOI

13

X-Ray Check

Hotline

+86 156 2284 1981